The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Jun. 12, 2017
Shinko Electric Industries Co., Ltd., Nagano, JP;
Tohoku Seimitsu Co., Ltd., Iwate, JP;
Norio Shiraiwa, Nagano, JP;
Syuuichi Andou, Iwate, JP;
Kenji Takatsuka, Iwate, JP;
Katsuhiro Kosuga, Iwate, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
TOHOKU SEIMITSU CO., LTD., Iwate, JP;
Abstract
A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.