The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847376 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 24, 2020

Filed:

Apr. 10, 2019
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Yusuke Osawa, Yokkaichi, JP;

Syo Fukata, Yokkaichi, JP;

Naoto Umehara, Yokkaichi, JP;

Sung Tae Lee, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 27/11551 (2017.01); H01L 27/11578 (2017.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01J 37/32082 (2013.01); H01J 37/32715 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/31144 (2013.01); H01L 21/67069 (2013.01); H01J 2237/18 (2013.01); H01J 2237/334 (2013.01); H01L 27/11551 (2013.01); H01L 27/11578 (2013.01);
Abstract

A first material layer, a second material layer, and a photoresist layer may be formed over a substrate. The second material layer may be patterned by transfer of a lithographic pattern therethrough. A conformal spacer layer may be formed over the patterned second material layer in a chamber enclosure of an in-situ deposition-etch apparatus. Spacer films may be formed by anisotropically etching the conformal spacer layer in the chamber enclosure of the in-situ deposition-etch apparatus. The first material layer may be anisotropically etched using a combination of the patterned second material layer and the spacer films as an etch mask in the in-situ deposition-etch apparatus. A high fidelity pattern may be transferred into the first material layer with reduced line edge roughness, reduced line width roughness, and without enlargement of lateral dimensions of openings in the first material layer.


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