The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Mar. 08, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Keiko Chiba, Utsunomiya, JP;

Toshiki Ito, Kawasaki, JP;

Weijun Liu, Cedar Park, TX (US);

Timothy Brian Stachowiak, Austin, TX (US);

Niyaz Khusnatdinov, Round Rock, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); C09D 4/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); C09D 4/00 (2013.01);
Abstract

A pattern is formed on a substrate with forming a layer of a first curable composition (A1) containing a component (a1) as a polymerizable compound and a first component (c1) as a surfactant on a surface of the substrate, then dispensing droplets of a second curable composition (A2) containing a component (a2) as a polymerizable compound and a second component (c2) as a surfactant onto the layer formed of the first curable composition (A1), subsequently sandwiching a mixture layer of the first and second curable compositions (A1) and (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after curing. The first curable composition (A1) contains at least 0.5 wt % of the first component (c1), the second curable composition (A2) contains at least 0.5 wt % of the second component (c2).


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