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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10844475 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Dec. 13, 2016

Method for manufacturing sputtering target

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Shuichi Irumata, Tokyo, JP;

Takashi Fukutani, Ibaraki, JP;

Ryo Suzuki, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Marshall, Gerstein & Borun LLP

Primary Examiner:

Jessee R Roe

Assistant Examiner:

Rebecca Janssen

Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B22F 5/00 (2006.01); C23C 14/34 (2006.01); C04B 35/653 (2006.01); C04B 35/01 (2006.01); C04B 35/64 (2006.01); B22F 3/16 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 3/1055 (2013.01); B22F 3/16 (2013.01); B22F 5/006 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C04B 35/01 (2013.01); C04B 35/64 (2013.01); C04B 35/653 (2013.01); C04B 2235/3286 (2013.01); C04B 2235/3293 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5463 (2013.01); C04B 2235/665 (2013.01); C04B 2235/77 (2013.01); Y02P 10/25 (2015.11);
Abstract

(1) The present invention provides a method for manufacturing a sputtering target in which the controllability of crystal orientation is improved. Specifically, the present invention provides a method for manufacturing a sputtering target, comprising a step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired target shape using an additive manufacturing method. (2) The present invention provides a method for manufacturing a sputtering target capable of improving production efficiency. Specifically, the present invention provides a method for manufacturing a sputtering target in which a backing plate and a sputter part are bonded, comprising a shaping step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired sputter part shape on a backing plate or on an intermediate material provided on a backing plate using an additive manufacturing method.

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