The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jul. 07, 2017
Tokyo Electron Limited, Tokyo, JP;
Masataka Matsunaga, Koshi, JP;
Takahiro Masunaga, Koshi, JP;
Yasutaka Soma, Koshi, JP;
Takashi Koga, Koshi, JP;
Shogo Hara, Koshi, JP;
Masaaki Umitsuki, Koshi, JP;
Kazutoshi Ishimaru, Koshi, JP;
Fumio Sakata, Koshi, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.