The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Oct. 18, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Kuo-Chiang Tsai, Hsinchu, TW;

Jyh-Huei Chen, Hsinchu, TW;

Jye-Yen Cheng, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 29/417 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/53257 (2013.01); H01L 29/4175 (2013.01);
Abstract

Methods of fabricating an integrated circuit device are provided. The integrated circuit device includes a transistor formed on a substrate. The transistor includes a source region, a drain region, and a gate structure between the source region and the drain region. The integrated circuit device also includes a first dielectric layer over the transistor and a first via contact partially in the first dielectric layer and electrically connected to the source region. The integrated circuit device further includes a second via contact partially in the first dielectric layer and electrically connected to the gate structure. In addition, the upper portion of the first via contact and the upper portion of the second via contact protrude from the first dielectric layer.


Find Patent Forward Citations

Tsai, Kuo-Chiang. (2020). Integrated circuit devices having raised via contacts and methods of fabricating the same (U.S. Patent No. 10840189). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10840189

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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