The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Nov. 28, 2018
Texas Instruments Incorporated, Dallas, TX (US);
Michael L. Meyers, Dallas, TX (US);
Scott F. Eisenhart, Allen, TX (US);
Richard J. Saye, Greenville, TX (US);
Sreenivasan K. Koduri, Allen, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A packaged semiconductor device includes a semiconductor die mounted on a leadframe, a housing for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the sidewalls of the housing, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.