The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Oct. 30, 2018
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

John Bultitude, Simpsonville, SC (US);

Philip M. Lessner, Simpsonville, SC (US);

Abhijit Gurav, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 7/00 (2006.01); H01G 4/258 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 2/08 (2006.01); H01G 4/38 (2006.01);
U.S. Cl.
CPC ...
H01G 4/258 (2013.01); H01G 2/08 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); Y10T 29/43 (2015.01);
Abstract

An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.


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