The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Sep. 14, 2016
Applicant:

T.rad Co., Ltd., Tokyo, JP;

Inventors:

Takuya Bungo, Tokyo, JP;

Atsushi Okubo, Tokyo, JP;

Taiji Sakai, Tokyo, JP;

Assignee:

T.RAD Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 3/04 (2006.01); F28F 3/08 (2006.01); H01L 23/473 (2006.01); F28D 1/03 (2006.01); F28F 9/00 (2006.01);
U.S. Cl.
CPC ...
F28F 3/048 (2013.01); F28D 1/0308 (2013.01); F28F 3/08 (2013.01); F28F 9/001 (2013.01); H01L 23/473 (2013.01); H05K 7/20 (2013.01); H05K 7/20254 (2013.01); H05K 7/20409 (2013.01);
Abstract

In a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and by laminating the plate in large numbers, the thickness of a second plate positioned second in the lamination direction from an end lid to which a semiconductor is attached is made greater than thickness of a first plate other than the second plate.


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