The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Nov. 29, 2019
Applicants:

Fu Ding Precision Component (Shen Zhen) Co., Ltd., Shenzhen, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventor:

Shuo-Hsiu Hsu, New Taipei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/24 (2006.01); H01R 13/428 (2006.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/2457 (2013.01); H01R 4/02 (2013.01); H01R 13/428 (2013.01);
Abstract

An electrical contact includes a main body, a supporting arm extending upwardly from an upper edge thereof, and a spring arm extending curvedly and upwardly from a lower edge thereof with a contacting region at a free end. The spring arm will contact the supporting arm when the spring arm is downwardly pressed by the CPU. A solder part is sidewardly connected to a downward extension formed on a lower portion of the main body and located beside the spring arm, and includes a vertical section extending from the side edge of the downward extension, a horizontal solder pad extending from a lower edge of the vertical direction wherein a curved joint is formed between the downward extension and the vertical section for easy adjusting the angle formed between the downward extension and the vertical section, thus being adapted to fit different CPUs and PCBs.


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