The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Oct. 19, 2017
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Seiya Masuda, Haibara-gun, JP;

Yoshitaka Kamochi, Haibara-gun, JP;

Atsushi Nakamura, Zwijndrecht, BE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); G03F 7/16 (2006.01); B32B 27/30 (2006.01); C08F 220/28 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/11 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0018 (2013.01); B32B 27/30 (2013.01); C08F 220/28 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/325 (2013.01); B32B 2309/105 (2013.01); B32B 2457/14 (2013.01); C08F 2220/281 (2013.01);
Abstract

Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit. The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.


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