The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jan. 22, 2019
Applicants:

Imec Vzw, Leuven, BE;

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Syed Muhammad Yasser Sherazi, Leuven, BE;

Julien Ryckaert, Schaerbeek, BE;

Juergen Boemmels, Heverlee, BE;

Guillaume Bouche, Brussels, BE;

Assignees:

IMEC VZW, Leuven, BE;

GLOBALFOUNDRIES INC., George Town, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 23/522 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41791 (2013.01); H01L 21/31116 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 23/5226 (2013.01); H01L 27/0886 (2013.01); H01L 29/0847 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 21/823437 (2013.01); H01L 29/6656 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01); H01L 2029/7858 (2013.01);
Abstract

A semiconductor device includes: (i) a substrate; (ii) a first elongated semiconductor structure extending in a first horizontal direction along the substrate and protruding vertically above the substrate, wherein a first set of source/drain regions are formed on the first semiconductor structure; (iii) a second elongated semiconductor structure extending along the substrate in parallel to the first semiconductor structure and protruding vertically above the substrate, wherein a second set of source/drain regions are formed on the second semiconductor structure; and (iv) a first set of source/drain contacts formed on the first set of source/drain regions, wherein a first source/drain contact of the first set of source/drain contacts includes: (a) a vertically extending contact portion formed directly above a first source/drain region of the first set of source/drain regions, and (b) a via landing portion protruding horizontally from the vertically extending contact portion in a direction towards the second semiconductor structure.


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