The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jul. 17, 2019
Applicant:
Danfoss Silicon Power Gmbh, Flensburg, DE;
Inventors:
Ronald Eisele, Surendorf, DE;
Frank Osterwald, Kiel, DE;
Assignee:
Danfoss Silicon Power GmbH, Flensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/29 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/291 (2013.01); H01L 23/4334 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01);
Abstract
A power module () having a leadframe (), a power semiconductor () arranged on the leadframe (), a base plate () for dispersing heat generated by the power semiconductor () and a potting compound () surrounding the leadframe () and the power semiconductor (), that physically connects the power semiconductor () and/or the leadframe () to the base plate().