The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Nov. 30, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Qing Cao, Yorktown Heights, NY (US);

Kangguo Cheng, Schenectady, NY (US);

Zhengwen Li, Scarsdale, NY (US);

Fei Liu, Yorktown Heights, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06N 3/063 (2006.01); G06N 3/04 (2006.01); G06N 3/08 (2006.01);
U.S. Cl.
CPC ...
G06N 3/0635 (2013.01); G06N 3/04 (2013.01); G06N 3/049 (2013.01); G06N 3/08 (2013.01);
Abstract

A three-dimensional integration of synapse circuitry is formed. One or more neuron layers each comprises a plurality of computing elements, and one or more synapse layers each comprising an array of memory elements are formed on top of the one or more neuron layers. A plurality of staggered through-silicon vias (TSVs) connect the one or more neuron layers to the one or more synapse layers and operate as communication links between one or more computing elements in the one or more neuron layers and one or more memory elements in the one or more synapse layers.


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