The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Mar. 21, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Xiaoning Ye, Portland, OR (US);
Jimmy Hsu, Taoyuan, TW;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01); H05K 3/38 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4676 (2013.01); H05K 1/036 (2013.01); H05K 1/092 (2013.01); H05K 3/0017 (2013.01); H05K 3/3452 (2013.01); H05K 3/386 (2013.01); H05K 1/0242 (2013.01); H05K 3/4673 (2013.01);
Abstract
A printed circuit board, according one embodiment, includes a reference layer; a dielectric layer disposed on the reference layer; and a conductor layer adhered to the dielectric layer with an adhesive layer disposed between the dielectric layer and the conductor layer. The conductor layer has a smooth surface facing the dielectric layer having a roughness (Rz) of less than two microns.