The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jun. 27, 2019
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Lulu Peng, Singapore, SG;

Donald Ray Disney, Singapore, SG;

Lawrence Selvaraj Susai, Singapore, SG;

Rajesh Sankaranarayanan Nair, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B23K 26/342 (2014.01); B23K 26/00 (2014.01); B33Y 80/00 (2015.01); B23K 26/08 (2014.01); B23K 15/00 (2006.01); B23K 26/082 (2014.01); B29C 64/153 (2017.01); C23C 24/10 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 41/16 (2006.01); H01F 41/22 (2006.01); B29K 79/00 (2006.01); B29L 31/34 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01); B23K 101/42 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); B22F 3/1055 (2013.01); B23K 15/0086 (2013.01); B23K 15/0093 (2013.01); B23K 26/0006 (2013.01); B23K 26/082 (2015.10); B23K 26/0876 (2013.01); B23K 26/342 (2015.10); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C23C 24/106 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 41/046 (2013.01); H01F 41/16 (2013.01); H01F 41/22 (2013.01); H01L 21/32051 (2013.01); H01L 23/5227 (2013.01); B22F 2998/10 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/172 (2018.08); B29K 2079/08 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0008 (2013.01); B29L 2031/34 (2013.01); C22C 2202/02 (2013.01); H01F 2017/0066 (2013.01);
Abstract

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.


Find Patent Forward Citations

Loading…