The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
May. 31, 2016
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/562 (2013.01); H01L 25/105 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01); H01L 2924/3511 (2013.01);
Abstract
[Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a semiconductor device including this, and a composite sheet. [Solving Means] A semiconductor protective filmaccording to an embodiment of the present invention includes a protective layerformed of a non-conductive inorganic material and an adhesive layerprovided on one surface of the protective layer. The protective layerincludes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.