The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Jun. 28, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Shing-Yih Shih, New Taipei, TW;
Tieh-Chiang Wu, Taoyuan, TW;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/481 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 23/5384 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/97 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Some embodiments of the present disclosure disclose a method for forming semiconductor packages. The method includes disposing a plurality of semiconductor chips over a top side of a wafer, molding the plurality of semiconductor chips with a first molding material, and after molding the semiconductor chips, forming a composite layer over the plurality of semiconductor chips.