The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Dec. 19, 2016
Applicant:

Nexperia B.v., Nijmegen, NL;

Inventors:

Haibo Fan, Hong Kong, HK;

Pompeo v Umali, Hong Kong, HK;

Tim Boettcher, Lauenbrueck, DE;

Wai Wong Chow, Tai Po, HK;

Assignee:

NEXPERIA B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 23/3114 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 23/3107 (2013.01); H01L 24/83 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40491 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/8491 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract

Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.


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