The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Mar. 28, 2016
Applicant:
Lintec Corporation, Itabashi-ku, JP;
Inventors:
Yasuhiko Kakiuchi, Warabi, JP;
Takashi Akutsu, Saitama, JP;
Sayaka Bandou, Tokorozawa, JP;
Yuichiro Komasu, Kita, JP;
Assignee:
LINTEC CORPORATION, Itabashi-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); C09J 133/08 (2006.01); C09J 133/14 (2006.01); C09J 7/38 (2018.01); C09J 7/20 (2018.01); C09J 7/29 (2018.01); B32B 27/36 (2006.01); B32B 27/32 (2006.01); C08F 220/18 (2006.01); C08F 220/20 (2006.01); H01L 21/683 (2006.01); C09J 153/00 (2006.01); C09J 133/06 (2006.01); C08F 293/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); C08F 220/18 (2013.01); C08F 220/1804 (2020.02); C08F 220/20 (2013.01); C08F 293/005 (2013.01); C09J 7/20 (2018.01); C09J 7/29 (2018.01); C09J 7/385 (2018.01); C09J 7/387 (2018.01); C09J 133/066 (2013.01); C09J 133/08 (2013.01); C09J 133/14 (2013.01); C09J 153/00 (2013.01); H01L 21/304 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); C09J 2201/606 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/31 (2013.01); C09J 2423/006 (2013.01); C09J 2433/00 (2013.01); C09J 2453/00 (2013.01); C09J 2467/006 (2013.01); C09J 2475/003 (2013.01); H01L 2221/68381 (2013.01);
Abstract
The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.