The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jun. 03, 2015
Applicant:

Bemis Company, Inc., Neenah, WI (US);

Inventors:

Xiangke Shi, Neenah, WI (US);

Yuan Liu, Neenah, WI (US);

Assignee:

Bemis Company, Inc., Neenah, WI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 79/02 (2006.01); B65D 75/30 (2006.01); B65D 75/58 (2006.01); G01N 21/78 (2006.01); G01N 21/88 (2006.01); G01N 31/22 (2006.01);
U.S. Cl.
CPC ...
B65D 79/02 (2013.01); B65D 75/30 (2013.01); B65D 75/5855 (2013.01); G01N 21/78 (2013.01); G01N 21/8803 (2013.01); G01N 31/229 (2013.01);
Abstract

The present invention is directed to heat-seal condition indicating packages having a first sealing substrate comprising a leuco dye and a second sealing substrate comprising a leuco dye developer, and a leuco dye sensitizer which dissolves both the leuco dye and the leuco dye developer when melted which is disposed in or on the surface of either the first or second sealing substrata or disposed in or on the surface of both the first and second sealing substrates. The packages of the present invention further include a heat-seal produced between the first sealing substrate and the second sealing substrate which comprises a heat-seal defect-free state which produces a visible color change within the heat-seal after heat sealing, and/or a heat-seal defect state which produces no visible color change within the heat-seal after heat sealing.


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