The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Jul. 18, 2016
Applicant:

Rogers Germany Gmbh, Eschenbach, DE;

Inventors:

Andreas Meyer, Wenzenbach, DE;

Karsten Schmidt, Eschenbach, DE;

Assignee:

ROGERS GERMANY GMBH, Eschenbach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 9/00 (2006.01); B32B 5/12 (2006.01); B32B 5/20 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 9/06 (2006.01); B32B 29/08 (2006.01); H01L 23/373 (2006.01); H05K 1/05 (2006.01); B32B 15/04 (2006.01); B32B 15/12 (2006.01); B32B 29/00 (2006.01); C25D 11/04 (2006.01); C25D 17/12 (2006.01); C25D 11/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); C25D 11/08 (2006.01);
U.S. Cl.
CPC ...
B32B 9/005 (2013.01); B32B 5/12 (2013.01); B32B 5/20 (2013.01); B32B 7/12 (2013.01); B32B 9/041 (2013.01); B32B 9/06 (2013.01); B32B 15/043 (2013.01); B32B 15/12 (2013.01); B32B 15/20 (2013.01); B32B 29/002 (2013.01); B32B 29/08 (2013.01); C25D 11/005 (2013.01); C25D 11/04 (2013.01); C25D 17/12 (2013.01); H01L 23/3735 (2013.01); H05K 1/0201 (2013.01); H05K 1/0313 (2013.01); H05K 1/053 (2013.01); H05K 3/4688 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2264/107 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/54 (2013.01); B32B 2457/08 (2013.01); B32B 2605/00 (2013.01); C25D 11/08 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/11 (2013.01); H05K 2203/1126 (2013.01);
Abstract

The invention relates to a substrate () for electrical circuits comprising at least one first composite layer () which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer () and an aluminium layer () attached thereon, wherein at least the surface side of the aluminium layer () facing away from the copper layer () is anodized for the generation of an anodic or insulating layer () made of aluminium oxide, and wherein the anodic or insulating layer () made of aluminium oxide is connected to a metal layer () or at least one second composite layer (') or at least one paper-ceramic layer () via at least one adhesive layer (′).


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