The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jan. 16, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuki Inoue, Fukushima, JP;

Tatsuya Arisawa, Fukushima, JP;

Yuki Kitai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 71/12 (2006.01); B32B 15/08 (2006.01); H05K 1/03 (2006.01); B32B 27/18 (2006.01); C09D 163/00 (2006.01); H05K 3/38 (2006.01); C08G 59/68 (2006.01); H05K 1/09 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08J 5/24 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 15/08 (2013.01); B32B 27/18 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08G 59/4007 (2013.01); C08G 59/685 (2013.01); C08J 5/24 (2013.01); C09D 163/00 (2013.01); H05K 1/024 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/022 (2013.01); H05K 3/384 (2013.01); C08J 2363/00 (2013.01); C08J 2363/10 (2013.01); C08J 2471/12 (2013.01); H05K 3/0014 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/068 (2013.01);
Abstract

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 μm or less.


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