The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Nov. 15, 2017
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Hee Jung Kim, Daejeon, KR;
Nu Ri Na, Daejeon, KR;
Young Kook Kim, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); C09J 7/38 (2018.01); C09J 7/28 (2018.01); C09J 9/02 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C09J 7/28 (2018.01); C09J 7/385 (2018.01); C09J 9/02 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/2916 (2013.01); H01L 2224/2917 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29157 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/29172 (2013.01); H01L 2224/29179 (2013.01); H01L 2224/29181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/013 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/3025 (2013.01);
Abstract
There are provided an adhesive film for a semiconductor including: a conductive layer containing at least one metal selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of 0.05 μm or more; and an adhesive layer formed on at least one surface of the conductive layer and including a (meth)acrylate-based resin, a curing agent, and an epoxy resin, and a semiconductor device including the above-mentioned adhesive film.