The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Apr. 16, 2018
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Shinichi Uchida, Tokyo, JP;
Yasutaka Nakashiba, Ibaraki, JP;
Tetsuya Iida, Ibaraki, JP;
Shinichi Kuwabara, Ibaraki, JP;
Assignee:
Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76819 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 25/0657 (2013.01); H01L 28/10 (2013.01); H04B 5/0075 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes a step of: patterning a conductive film formed over an interlayer insulating film so as to form a coil and a conductive pattern in the same layer, and then forming unevennesses on a surface of the interlayer insulating film by etching a portion of the interlayer insulating film with using the coil and the conductive pattern as a mask.