logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10818591 B1

PDFFull Text
Date of Patent:
Oct. 27, 2020

Filed:

Apr. 16, 2018

Semiconductor device with inductive coupling and method of manufacturing the same

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shinichi Uchida, Tokyo, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Tetsuya Iida, Ibaraki, JP;

Shinichi Kuwabara, Ibaraki, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Matthew E Warren

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76819 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 25/0657 (2013.01); H01L 28/10 (2013.01); H04B 5/0075 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes a step of: patterning a conductive film formed over an interlayer insulating film so as to form a coil and a conductive pattern in the same layer, and then forming unevennesses on a surface of the interlayer insulating film by etching a portion of the interlayer insulating film with using the coil and the conductive pattern as a mask.

Find Patent Forward Citations

Uchida, Shinichi. (2020). Semiconductor device with inductive coupling and method of manufacturing the same (U.S. Patent No. 10818591). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10818591

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…