The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jul. 06, 2018
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Yukinori Hatori, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/051 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 21/4825 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 23/051 (2013.01); H01L 23/49513 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/29026 (2013.01); H01L 2224/29034 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83911 (2013.01); H01L 2924/014 (2013.01); H01L 2924/13091 (2013.01);
Abstract

An electronic component device includes a first lead frame having a first connection terminal and an electronic component. The first connection terminal includes a first metal electrode, a first pad part formed on an upper surface of the first metal electrode and formed by a metal plated layer, and a first metal oxide layer formed on an upper surface of the first metal electrode in a surrounding region of the first pad part so as to surround an outer periphery of the first pad part. The electronic component has a first terminal part provided on its lower surface. The first terminal part of the electronic component is connected to the first pad part of the first connection terminal via a metal joining material.


Find Patent Forward Citations

Hatori, Yukinori. (2020). Electronic component device (U.S. Patent No. 10818580). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10818580

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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