The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Oct. 15, 2018
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Inventors:
Shintaro Hayashi, Nagano, JP;
Kentaro Kaneko, Nagano, JP;
Tsukasa Nakanishi, Nagano, JP;
Misaki Imai, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49534 (2013.01); H01L 21/4828 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 23/49513 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
There is provided a lead frame. The lead frame includes: a die pad; a lead terminal that is separated from the die pad and disposed around the die pad; and a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal. The resin layer has an opening portion that exposes at least a lower surface of the lead terminal.