The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jun. 29, 2018
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Seiji Shimabukuro, Yokkaichi, JP;

Makoto Kamijo, Yokkaichi, JP;

Tetsuya Kaneko, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 27/115 (2017.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76849 (2013.01); H01L 21/76807 (2013.01); H01L 21/76834 (2013.01); H01L 21/76888 (2013.01); H01L 23/53266 (2013.01); H01L 27/115 (2013.01); H01L 21/02175 (2013.01); H01L 21/02244 (2013.01); H01L 21/02252 (2013.01); H01L 21/31111 (2013.01);
Abstract

A first metal interconnect structure embedded in a first dielectric material layer includes a first metallic nitride liner containing a first conductive metal nitride and a first metallic fill material portion. A second metal interconnect structure embedded in a second dielectric material layer overlies the first dielectric material layer. The second metal interconnect structure includes a pillar portion having a straight sidewall and a foot portion adjoined to a bottom periphery of the pillar portion and laterally protruding from the bottom periphery of the pillar portion. The foot portion can be formed by oxidizing a top surface of the first metallic fill material portion, removing the oxidized portion after formation of a cavity through the second dielectric material layer, and depositing a second metallic nitride liner in a volume from which the oxidized portion is removed.


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