The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Apr. 16, 2020
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Hiroaki Kodama, Ogaki, JP;

Kazuro Nishiwaki, Ogaki, JP;

Kazuhiko Kuranobu, Ogaki, JP;

Hiroaki Uno, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01F 27/40 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H05K 1/11 (2006.01); H01F 41/04 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01F 27/40 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/422 (2013.01); H05K 3/424 (2013.01);
Abstract

An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.


Find Patent Forward Citations

Loading…