The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Sep. 30, 2015
Applicant:

Sekisui Plastics Co., Ltd., Osaka, JP;

Inventors:

Hiromaru Yamamoto, Nara, JP;

Hironori Kobayashi, Nara, JP;

Haruhiko Matsuura, Nara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/18 (2006.01); C08J 9/228 (2006.01); C08J 9/16 (2006.01); C08J 9/232 (2006.01); C08J 9/14 (2006.01);
U.S. Cl.
CPC ...
C08J 9/18 (2013.01); C08J 9/142 (2013.01); C08J 9/16 (2013.01); C08J 9/228 (2013.01); C08J 9/232 (2013.01); C08J 2201/03 (2013.01); C08J 2203/12 (2013.01); C08J 2205/052 (2013.01); C08J 2379/08 (2013.01); C08J 2381/06 (2013.01);
Abstract

Provided is a bead expanded molded article comprising a plurality of resin expanded particles that are fusion-bonded with each other, in which the resin expanded particles mainly include a resin having a glass transition temperature of 180° C. or more.


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