The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Oct. 03, 2019
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Po-Hsuan Liao, Taoyuan, TW;
Wen-Fang Liu, Taoyuan, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H05K 1/036 (2013.01); H05K 1/115 (2013.01); H05K 3/002 (2013.01); H05K 3/107 (2013.01); H05K 3/465 (2013.01); H05K 3/0023 (2013.01); H05K 3/0041 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09727 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/1453 (2013.01);
Abstract
The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.