The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

May. 30, 2019
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Vishnu Khemka, Chandler, AZ (US);

Tanuj Saxena, Chandler, AZ (US);

Ganming Qin, Chandler, AZ (US);

Raghuveer Vankayala Gupta, Austin, TX (US);

Mark Edward Gibson, Austin, TX (US);

Moaniss Zitouni, Gilbert, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 21/308 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 21/02126 (2013.01); H01L 21/02238 (2013.01); H01L 21/28211 (2013.01); H01L 21/308 (2013.01); H01L 21/31111 (2013.01); H01L 29/401 (2013.01); H01L 29/404 (2013.01); H01L 29/4236 (2013.01); H01L 29/4916 (2013.01); H01L 29/66734 (2013.01); H01L 21/02255 (2013.01);
Abstract

A method for manufacturing a super-junction MOSFET entails forming a recessed shield electrode in a trench in a semiconductor layer of a substrate, the trench being lined with a first oxide layer. When the electrically conductive material forming the shield electrode is removed to recess the shield electrode, the first oxide layer on sidewalls of the trench is exposed. Removal of the first oxide layer from the sidewalls and from shield sidewalls of the electrode produces openings at a top part of the shield sidewalls. A second oxide layer is formed over the shield electrode and fills the openings. Part of the second oxide layer is removed to expose a top surface of the shield electrode. A gate dielectric is formed over the top surface of the shield electrode and conductive material is deposited over the gate dielectric in the trench to form a gate electrode of the MOSFET.


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