The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Mar. 15, 2019
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

Dou Dou Zhang, Wuhan, CN;

Jin Yu Qiu, Wuhan, CN;

Zhi Yang Song, Wuhan, CN;

Jun He, Wuhan, CN;

Zhi Hu Gao, Wuhan, CN;

Yaobin Feng, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/78 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01);
Abstract

Embodiments of semiconductor fabrication methods are disclosed. In an example, a method for forming a mark for locating patterns in semiconductor fabrication is disclosed. A wafer is divided into a plurality of shots. Each of the plurality of shots includes a semiconductor chip die. Four quarters of a locking corner mark are subsequently patterned, respectively, at four corners of four adjacent shots of the plurality of shots. Each quarter of the locking corner mark is symmetric to adjacent quarters of the locking corner mark and is separated from the adjacent quarters of the locking corner mark by a nominally same distance. The locking corner mark is set as an origin for locating patterns in at least one of the four adjacent shots in semiconductor fabrication.


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