The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Nov. 13, 2017
Shinko Electric Industries Co., Ltd., Nagano, JP;
Kazuhiro Kobayashi, Nagano, JP;
Yusuke Karasawa, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A method of manufacturing a wiring substrate includes providing a support that includes a support substrate and first and second metal layers stacked in order over the support substrate. A surface of the second metal layer facing away from the first metal layer is a roughened surface or formed of particles. The second metal layer is selectively etchable with respect to the first metal layer. The method further includes selectively forming a third metal layer on the surface of the second metal layer, forming a first wiring layer that is a laminate of the second and third metal layers by simultaneously roughening the third metal layer and dissolving the second metal layer not covered with the third metal layer using an etchant, forming an insulating layer that covers the first wiring layer on the first metal layer, removing the support substrate, and removing the first metal layer by etching.