The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Nov. 26, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Benjamin Stassen Cook, Rockwall, TX (US);

Archana Venugopal, Dallas, TX (US);

Luigi Colombo, Dallas, TX (US);

Robert Reid Doering, Garland, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 21/4882 (2013.01); H01L 21/76801 (2013.01); H01L 21/76877 (2013.01); H01L 23/3731 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/5226 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 21/76829 (2013.01); H01L 23/53295 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/14519 (2013.01);
Abstract

An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region has a plurality of interconnect levels. The integrated circuit includes a thermal routing structure in the interconnect region. The thermal routing structure extends over a portion, but not all, of the integrated circuit in the interconnect region. The thermal routing structure includes a cohered nanoparticle film in which adjacent nanoparticles cohere to each other. The thermal routing structure has a thermal conductivity higher than dielectric material touching the thermal routing structure. The cohered nanoparticle film is formed by a method which includes an additive process.


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