The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Mar. 22, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Toshifumi Watanabe, Tokyo, JP;

Satoru Yamamoto, Tokyo, JP;

Yu Machida, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); B24B 37/00 (2012.01); B24B 21/00 (2006.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B24B 9/065 (2013.01); B24B 21/002 (2013.01); B24B 21/004 (2013.01); B24B 21/008 (2013.01); B24B 37/00 (2013.01); H01L 21/02021 (2013.01); H01L 21/02087 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract

A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.


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