The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 08, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Ming-Wei Tsai, Hsinchu County, TW;

King-Yuen Wong, Tuen Mun, HK;

Chih-Wen Hsiung, Hsinchu, TW;

Ming-Cheng Lin, Yilan County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/22 (2006.01); H01L 21/283 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 21/28 (2006.01); H01L 21/765 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/8234 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/283 (2013.01); H01L 21/02107 (2013.01); H01L 21/28 (2013.01); H01L 21/28587 (2013.01); H01L 21/765 (2013.01); H01L 21/76897 (2013.01); H01L 21/823418 (2013.01); H01L 21/823437 (2013.01); H01L 21/823456 (2013.01); H01L 29/401 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/42316 (2013.01); H01L 29/66409 (2013.01); H01L 29/66431 (2013.01); H01L 29/66462 (2013.01); H01L 29/778 (2013.01); H01L 29/7786 (2013.01); H01L 29/2003 (2013.01); H01L 2229/00 (2013.01);
Abstract

Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes a semiconductive substrate. A donor-supply layer is over the semiconductive substrate. The donor-supply layer includes a top surface. A gate structure, a drain, and a source are over the donor-supply layer. A passivation layer covers conformally over the gate structure and the donor-supply layer. A gate electrode is over the gate structure. A field plate is disposed on the passivation layer between the gate electrode and the drain. The field plate includes a bottom edge. The gate electrode having a first edge in proximity to the field plate, the field plate comprising a second edge facing the first edge, a horizontal distance between the first edge and the second edge is in a range of from about 0.05 to about 0.5 micrometers.


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