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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10810396 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Jul. 21, 2017

Fingerprint identification apparatus and electronic device

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yanan Jia, Beijing, CN;

Haisheng Wang, Beijing, CN;

Chun Wei Wu, Beijing, CN;

Yingming Liu, Beijing, CN;

Rui Xu, Beijing, CN;

Lijun Zhao, Beijing, CN;

Changfeng Li, Beijing, CN;

Yuzhen Guo, Beijing, CN;

Pengpeng Wang, Beijing, CN;

Yanling Han, Beijing, CN;

Xiaoliang Ding, Beijing, CN;

Wei Liu, Beijing, CN;

Jing Lv, Beijing, CN;

Xue Dong, Beijing, CN;

Assignee:

BOE Technology Group Co., Ltd., Beijing, CN;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Ming Y Hon

Int. Cl.
CPC ...
G06K 9/00 (2006.01); G02F 1/335 (2006.01); H01L 23/532 (2006.01); G02F 1/1335 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 27/30 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0004 (2013.01); G02F 1/133514 (2013.01); G06K 9/00046 (2013.01); H01L 23/5329 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 27/307 (2013.01); H01L 27/3244 (2013.01); G02F 1/13338 (2013.01);
Abstract

A fingerprint identification apparatus and an electronic device having the fingerprint identification apparatus. The fingerprint identification apparatus includes: a first substrate; a second substrate disposed opposite to the first substrate; and a fingerprint identification sensor disposed between the first substrate and the second substrate, where the fingerprint identification sensor comprises a plurality of photoelectric induction units, and each of the photoelectric induction units comprises a curved photoelectric induction part.

Find Patent Forward Citations

Jia, Yanan. (2020). Fingerprint identification apparatus and electronic device (U.S. Patent No. 10810396). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10810396

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