The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Feb. 11, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventor:

Chun-Hsi Huang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); B24B 37/015 (2012.01); H01L 21/66 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/042 (2013.01); H01L 21/30625 (2013.01); H01L 22/26 (2013.01);
Abstract

The present disclosure describes a method and apparatus to adjust a wafer's polishing rate based on the temperature of the air received by the air chambers of a polishing head. The method includes supplying pressurized air to a temperature module coupled to a polishing head. The temperature module adjusts a temperature of the pressurized air that is supplied to the polishing head. The method further includes supplying the one or more air chambers of the polishing head with the temperature controlled pressurized air from the temperature module and polishing the wafer by rotating the wafer against a polishing pad.


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