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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10807198 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Jan. 26, 2018

Laser processing apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Yuri Ban, Tokyo, JP;

Yuta Yoshida, Tokyo, JP;

Kentaro Odanaka, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Erin Deery

Int. Cl.
CPC ...
B23K 26/364 (2014.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); B23K 26/03 (2006.01); H01L 21/78 (2006.01); B23K 103/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/032 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); B23K 2103/56 (2018.08); H01L 21/561 (2013.01); H01L 21/6838 (2013.01); H01L 23/3178 (2013.01);
Abstract

A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an X-axis moving unit that moves the chuck table in an X-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. The examination unit includes: a line sensor that extends in a Y-axis direction; and a control unit that determines the result of processing through reception by the line sensor of light from the light emitting body through the through-groove. The line sensor images the whole surface of the packaged wafer being held by the chuck table.

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