The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Mar. 29, 2017
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;
Hai Ting Li, Shanghai, CN;
Abstract
A method for fabricating a semiconductor structure includes providing a wafer and a carrier wafer. The wafer includes a first bonding surface and a plurality of radio-frequency (RF) devices and the carrier wafer includes a second bonding surface. The method further includes performing a surface treatment process on the second bonding surface to convert a surface portion of the carrier wafer into a barrier layer to suppress movement of induced electrical charges in the carrier wafer, and then bonding the wafer with the carrier wafer through the first bonding surface and the second bonding surface, respectively.