IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10804111 B1

PDFFull Text
Date of Patent:
Oct. 13, 2020

Filed:

Sep. 15, 2016

Method for roughening surface using wet treatment

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Keisuke Hashimoto, Toyama, JP;

Yasunobu Someya, Toyama, JP;

Takahiro Kishioka, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/033 (2006.01); H01L 21/308 (2006.01); H01L 33/22 (2010.01); H01L 31/0236 (2006.01); H01L 51/52 (2006.01); C09D 161/34 (2006.01); C03C 17/34 (2006.01); C09K 13/06 (2006.01); C08F 212/32 (2006.01); C09K 13/08 (2006.01); C03C 17/00 (2006.01); C08G 14/06 (2006.01); C03C 15/00 (2006.01); C09D 7/40 (2018.01); C09D 125/02 (2006.01); C09D 161/18 (2006.01); C08K 3/22 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); C03C 15/00 (2013.01); C03C 17/009 (2013.01); C03C 17/34 (2013.01); C08F 212/32 (2013.01); C08G 14/06 (2013.01); C09D 7/67 (2018.01); C09D 7/68 (2018.01); C09D 125/02 (2013.01); C09D 161/18 (2013.01); C09D 161/34 (2013.01); C09K 13/06 (2013.01); C09K 13/08 (2013.01); H01L 21/0337 (2013.01); H01L 21/3086 (2013.01); H01L 31/02366 (2013.01); H01L 33/22 (2013.01); H01L 51/5275 (2013.01); C03C 2217/445 (2013.01); C03C 2217/478 (2013.01); C03C 2218/33 (2013.01); C08K 2003/2241 (2013.01); H01L 31/02168 (2013.01); H01L 51/5262 (2013.01); H01L 2251/5369 (2013.01); Y02E 10/549 (2013.01);
Abstract

A method for roughening a surface of a substrate, including: applying a composition containing inorganic particles and organic resin to the surface of the substrate and drying and curing the composition to form an organic resin layer; and etching the substrate by a solution containing hydrogen fluoride, hydrogen peroxide, or an acid, to roughen the surface. Preferably, the solution contains hydrogen fluoride and ammonium fluoride or hydrogen peroxide and ammonia, the resin layer contains a ratio of the particles to the resin of 5 to 50 parts by mass to 100 parts by mass, and the composition is a mixture of silica sol wherein silica is dispersed as the inorganic particles in organic solvent or titanium oxide sol wherein titanium oxide is dispersed, with a solution of the organic resin.

Find Patent Forward Citations

Loading…