Temperature management in open-channel memory devices

Abstract

Embodiments of the present disclosure are directed towards apparatuses and methods for temperature management of a non-volatile memory device, e.g., an open-channel solid state device (OCSSD). In embodiments, an apparatus includes a temperature manager operatively coupled to the processor to submit a request for a temperature of an individual die of a memory device and based at least in part on a response to the request that includes the received temperature of the individual die, control access to the individual die by selectively restricting access to the individual die, while permitting access to another individual die on the memory device. In embodiments, the request is submitted via an input/output (I/O) path or I/O queue and includes a physical address of the individual memory die. Additional embodiments may be described and claimed.