The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Dec. 13, 2018
Applicant:

Keiwa Inc., Tokyo, JP;

Inventor:

Motohiko Okabe, Tokyo, JP;

Assignee:

Keiwa Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/02 (2006.01); G02B 6/00 (2006.01); G02F 1/13357 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); G02B 5/0205 (2013.01); G02B 5/0242 (2013.01); G02B 6/00 (2013.01); G02F 1/133504 (2013.01);
Abstract

A light diffusion plate for a direct-lit backlight unit is provided which is capable of inhibiting generation of defects in production, and which is superior in mechanical strength even if being formed to be thin. The light diffusion plate for a direct-lit backlight unit includes a resin matrix, and a diffusion agent dispersed in the resin matrix, in which a principal component of the resin matrix is a polycarbonate resin, a ratio Mw/Mn of a polystyrene equivalent weight average molecular weight Mw to a number average molecular weight Mn of the polycarbonate resin, as determined by gel permeation chromatography is no less than 1.8 and no greater than 3.2, and the weight average molecular weight Mw of the polycarbonate resin is no less than 3.0×10and no greater than 6.5×10. The light diffusion plate has an average thickness of preferably no less than 0.1 mm and no greater than 1.0 mm.


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