The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Oct. 03, 2018
Applicants:

Sumitomo Electric Device Innovations, Inc., Yokohama-shi, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Kazuhiro Yamaji, Yokohama, JP;

Yasushi Fujimura, Osaka, JP;

Taichi Misawa, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/015 (2006.01); H01S 5/00 (2006.01); H01S 5/026 (2006.01); H01S 5/022 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
G02F 1/015 (2013.01); H01S 5/0085 (2013.01); H01S 5/0265 (2013.01); H01S 5/02252 (2013.01); H01S 5/02276 (2013.01); G02F 2001/0157 (2013.01); G02F 2201/12 (2013.01); G02F 2201/58 (2013.01); H01S 5/02208 (2013.01); H01S 5/4025 (2013.01);
Abstract

An optical module including a source assembly is disclosed. The source assembly provides a semiconductor optical device, a wiring substrate, and a bridge substrate. The semiconductor optical device includes an electrode and a pad that receives a driving signal therethrough. The wiring substrate, which is arranged side by side with respect to the semiconductor optical device, provides a signal line and a ground line surrounding the signal line. The bridge substrate includes a signal line and a ground line surrounding the signal line. A feature of the optical module is that the bridge substrate is placed on the semiconductor optical device and the wiring substrate such that a transmission line thereof faces the semiconductor optical device and the wiring substrate, and one end of the signal line thereof is connected with the pad of the semiconductor optical device through a post, and another end of the signal line thereof is connected with an end of the signal line in the wiring substrate through another post.


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