The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Mar. 03, 2017
Applicant:

Threebond Co., Ltd., Hachioji-shi, Tokyo, JP;

Inventors:

Tetsunori Soga, Hachioji, JP;

Hiroshi Takebe, Hachioji, JP;

Assignee:

THREEBOND CO., LTD., Hachioji-Shi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 123/22 (2006.01); C09J 5/06 (2006.01); H01M 8/0273 (2016.01); H01M 8/0282 (2016.01); H01M 8/0284 (2016.01); H01M 8/1004 (2016.01); C08K 5/3472 (2006.01); C08K 5/3492 (2006.01); C08K 5/5425 (2006.01); H01M 8/1018 (2016.01);
U.S. Cl.
CPC ...
C09J 123/22 (2013.01); C09J 5/06 (2013.01); H01M 8/0273 (2013.01); H01M 8/0282 (2013.01); H01M 8/0284 (2013.01); H01M 8/1004 (2013.01); C08K 5/3472 (2013.01); C08K 5/3492 (2013.01); C08K 5/5425 (2013.01); C09J 2423/00 (2013.01); H01M 2008/1095 (2013.01);
Abstract

The present invention has an object to produce a curable resin composition that achieves both low-temperature curability and low compression set. Provided is a sealing agent for fuel cell, comprising (A) to (D) ingredients: (A) ingredient: a vinyl polymer having one or more alkenyl groups per molecule and being liquid at 25° C.; (B) ingredient: a compound having one or more hydrosilyl groups per molecule; (C) ingredient: a hydrosilylation catalyst; and (D) ingredient: a heavy metal deactivator being one or more compounds selected from the group consisting of amino group-containing triazine compounds, aminotriazole compounds, and hydrazide compounds.


Find Patent Forward Citations

Loading…