The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Nov. 29, 2017
Applicant:
Tohoku University, Sendai-shi, Miyagi, JP;
Inventors:
Junichi Koike, Sendai, JP;
Reza Arghavani, Scotts Valley, CA (US);
Assignee:
TOHOKU UNIVERSITY, Sendai-shi, Miyagi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/485 (2006.01); H01L 21/8238 (2006.01); H01L 21/768 (2006.01); H01L 27/11524 (2017.01); H01L 27/11551 (2017.01); H01L 27/11529 (2017.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 29/45 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 23/53228 (2013.01); H01L 21/76841 (2013.01); H01L 21/76895 (2013.01); H01L 21/823821 (2013.01); H01L 23/485 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11551 (2013.01); H01L 29/41791 (2013.01); H01L 29/456 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A semiconductor device includes a substrate, a conductive wiring which comprises cobalt or copper and is electrically connected to the substrate, an insulating material which electrically isolates the conductive wiring from neighboring wiring, and a first barrier layer which comprises a first cobalt alloy and is disposed between the conductive wiring and the insulating material.