The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
May. 15, 2019
Infineon Technologies Ag, Neubiberg, DE;
Chau Fatt Chiang, Melaka, MY;
Khay Chwan Saw, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes an electrically insulating first encapsulant body having an upper surface, a first semiconductor die encapsulated within the first encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the first encapsulant body, a plurality of electrically conductive leads, each of the leads having interior ends that are encapsulated within the first encapsulant body and outer ends that are exposed from the first encapsulant body, and a first direct electrical connection between the first conductive pad and the interior end of a first lead from the plurality. The first direct electrical connection includes a first conductive track formed in the upper surface of the first encapsulant body. The first encapsulant body includes a laser activatable mold compound. The first conductive track is formed in a first laser activated region of the laser activatable mold compound.