The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Mar. 04, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
John Fallin, Beaverton, OR (US);
Daniel J. Ragland, Sherwood, OR (US);
Jonathan P. Douglas, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); G06F 1/20 (2006.01); G06F 1/26 (2006.01); G06F 17/50 (2006.01); G11C 5/00 (2006.01); G11C 29/50 (2006.01); G06F 11/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); G06F 1/206 (2013.01); G06F 11/1417 (2013.01); H01L 23/473 (2013.01); G06F 2200/201 (2013.01);
Abstract
Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.