The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Aug. 10, 2017
Applicant:

Entegris, Inc., Billerica, MA (US);

Inventors:

Philip S. H. Chen, Bethel, CT (US);

Bryan C. Hendrix, Danbury, CT (US);

Thomas H. Baum, New Fairfield, CT (US);

Assignee:

ENTEGRIS, INC., Billerica, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/16 (2006.01); C23C 16/30 (2006.01); C23C 16/02 (2006.01); C23C 16/18 (2006.01); C07F 15/06 (2006.01); B32B 15/04 (2006.01); C22C 19/07 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C23C 16/16 (2013.01); B32B 15/04 (2013.01); C07F 15/06 (2013.01); C22C 19/07 (2013.01); C23C 16/0281 (2013.01); C23C 16/18 (2013.01); C23C 16/30 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2457/14 (2013.01); H01L 21/76876 (2013.01); H01L 21/76879 (2013.01);
Abstract

A deposited cobalt composition is described, including cobalt and one or more alloy component that is effective in combination with cobalt to enhance adhesion to a substrate when exposed on the substrate to variable temperature and/or delaminative force conditions, as compared to corresponding elemental cobalt, wherein the one or more alloy component is selected from the group consisting of boron, phosphorous, tin, antimony, indium, and gold. Such deposited cobalt composition may be employed for metallization in semiconductor devices and device precursor structures, flat-panel displays, and solar panels, and provides highly adherent metallization when the metallized substrate is subjected to thermal cycling and/or chemical mechanical planarization operations in the manufacturing of the semiconductor, flat-panel display, or solar panel product.


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